These applications require higher performance that only custom hardware can achieve, and the fastest way to develop custom hardware is to use FPGAs.
This article will discuss the advantages of using SoM to develop embedded systems, which require FPGAs to provide higher processing capabilities. This article will also introduce various FPGA SoMs and discuss their use in embedded design development.
The role of FPGA modular systemsThe System of Modularity (SoM) can help designers develop embedded systems with custom interfaces in a specific form factor without having to develop a core processing system from scratch. Designers can insert a pre-designed and tested SoM into a pre-designed or customized carrier card to create an embedded design, which has the same function as a fully customized design, but requires much less time for hardware development.
Compared with developing hardware from scratch, using SoM has several advantages, including:
Cost saving (in the process of developing and debugging SoC-based circuit boards, very high non-recurring engineering costs will be incurred)
Reduce design risk
Multiple SoC options (thanks to the pluggability of SoM)
Small package
Parallel hardware and software development
The market once occupied by microprocessors and microcontrollers is now replaced by SoM, and through-hole and socket-type components have lost their dominance. Pin compatibility allows designers to choose from a range of compatible processors, choosing a processor with the correct clock rate and appropriate on-chip memory capacity. However, with the increase in the number of pins and the adoption of surface mount packaging technology, this design method has become obsolete, and SoM has emerged with it, and its form factor and base surface are the same as the previous pin-compatible microcontroller series The role of.
If SoM is used as the computing platform of the project, design engineers can concentrate their energy and resources to develop the final application without getting lost in the tedious details of designing the computing platform. For example, at clock rates of several hundred megahertz (MHz), the layout of the SDRAM circuit board connected to the application processor becomes increasingly difficult due to differential trace delay, noise, crosstalk, and many other challenges. However, SoM vendors have already completed a lot of design work before the start of the project, so that they can solve these problems and shorten the time to market.
To select a suitable SoM series for an embedded development project, various factors must be carefully analyzed, including the expected embedded resource requirements, and the requirements for design scalability, future adaptability, and ease of use. This helps to choose the appropriate SoM form factor and floor size, and provides a wealth of alternatives to deal with known challenges and unforeseen future challenges. If the selected SoM series contains multiple product members and has compatible dimensions and connector base surfaces, the design team's selection range can be expanded and the product can better withstand future tests.
New SoM based on SoC with processor and FPGAXilinx Zynq SoC offers a variety of different processor configurations and speeds, as far as the FPGA structure on the chip is concerned, there are even more choices. Choosing a SoM series based on a hybrid processor/FPGA SoC (such as Xilinx Zynq-7000 series) can expand the range of choices and improve the future adaptability of the product.
An example of this type of SoM series is the TE0782 series from Trenz Electronic (Figure 1) and the supporting SoM test board TEBT0782-01. Trenz Electronic TE0782 series modules use one of the three members of the Xilinx Zynq-7000 SoC series:
TE0782-02-035-2I based on Xilinx Zynq Z-7035 SoC
TE0782-02-045-2I based on Xilinx Zynq Z-7045 SoC
TE0782-02-100-2I based on Xilinx Zynq Z-7100 SoC
All three SoMs have the same connector footprint, including three Samtec LSHM non-polarized connectors with hundreds of I/O pins, and there are power and ground pins between the SoM and the carrier board .
Figure 1: Trenz Electronic’s TE0782 SoM uses one of the three Xilinx Zynq Z-7000 SoCs, and also provides 1 GB of SDRAM and other non-volatile memory. (Image source: Trenz Electronic)
To see the flexibility of the SoM design method, perhaps the best way is to first look at the TE0703 carrier board of the TE0782 SoM series, then return to the SoM through the I/O pins and look at the SoM resources (Figure 2).
Figure 2: The Trenz TE0703 carrier board taps many I/O pins from the relevant 4 x 5 cm SoM board to other parts of the embedded system. (Image source: Trenz Electronic)
The block diagram of TE0703 shows many important I/O functions that are separated from the SoM board, including:
1 Gbit/s Ethernet
USB and micro USB
Micro SD card
Hundreds of I/O pins (configurable as a single digital I/O pin, or as a low-voltage differential signal pair (LVDS))
SoM and SBC have their own purposesProcessing speed, response time, and I/O capability are the salient features of SoM. However, SBCs are often integrated in embedded systems, such as the Arduino Uno and Raspberry Pi series, because these products also have a broad support base. Therefore, Trenz Electronic also provides corresponding versions of Arduino and Raspberry Pi development boards: TE0723-03M ArduZynq and TE0726-03M ZynqBerry based on Xilinx Zynq-7000 SoC. These SBCs have built a bridge for connecting many existing plug-in cards, such as Arduino expansion boards and various Raspberry expansion boards.
Compared with the FPGA capacity integrated into three Trenz Electronic SoMs (using Zynq Z-7035, Zynq Z-7045 and Zynq Z-7100 SoC components), Zynq Z integrated into TE0723-03M ArduZynq and TE0726-03M ZynqBerry SBC There is a significant difference in the FPGA capacity of the -7010 SoC. Although all Zynq-7000 SoCs use dual-core Arm Cortex-A9 processors, there are differences in the number of FPGAs on the components, as shown in Table 1:
Xilinx Zynq SoC programmable logic unit block RAM capacity (MB) DSP slice Z-701028K2.180Z-7035275K17.6900Z-7045350K19.2900Z-7100444K26.52020Table 1: The Xilinx Zynq-7000 SoC (Z-7035, Z-7045, and Z-7100) used in Trenz Electronic SoM provides more FPGA resources than the Zynq Z-7010 used in Trenz Electronic ArduZynq and ZynqBerry SBC Resources. (Data source: Digi-Key Electronics)
In addition, TE0723-03M ArduZynq and TE0726-03M ZynqBerry SBC only provide 512 MB of onboard SDRAM, while TE0782 SoM provides 1 GB.
Trenz Electronic provides a variety of carrier boards for its SoM, including TE0703-05, TE0706-02, TE0701-06, and TEB0745-02. These carrier boards provide many standardized I/O functions. One of the carrier cards may be suitable for a specific embedded application, but the embedded system design can also be split into custom-designed carrier boards that can accept SoM series products to meet different processing needs. This flexibility highlights the advantages of the design approach that uses the SoM series as the basis for embedded design. SoM's consistent standardized connector base surface allows SoM to be easily interchanged to adapt to changes in system specifications.
to sum upSoM can greatly shorten the time required for prototyping embedded systems and reduce project risks. As long as the SoM form factor and connector base surface are supported, SoM with more FPGA resources can be inserted to meet the growing demand. In addition, a variety of compatible SoMs based on Xilinx Zynq-7000 SoC combine the processing power of dual-core Arm Cortex-A9 processors with FPGA resources, helping to accelerate the development of embedded designs.
This embedded design method using SoM can not only shorten the time required to develop the hardware part, but also allow software development to start earlier in the project, thereby reducing the design
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