Huacan Optoelectronics: New progress in the development of Mini LED chips

Recently, Huacan Optoelectronics briefly talked about some progress made in the Mini LED chip on the interactive platform.

Huacan Optoelectronics said that in terms of Mini RGB, Huacan Optoelectronics uses a more stable DBR+ITO flip-chip, and optimizes the insulation of the chip steps and sidewalls, further improving the reliability of the chip. Sex. In addition, the substrate transfer technology of the Mini red LED chip is optimized to improve the overall yield while improving reliability.

Huacan Optoelectronics said that the Mini RGB chip has been mass-produced and has become a supplier to several major downstream players at home and abroad. In terms of Mini BLU, in order to achieve uniform light mixing of ultra-thin backlight modules, Huacan Optoelectronics cooperates with downstream and terminal manufacturers at home and abroad to develop LED chips that are easy to achieve uniform light mixing. At present, Huacan Optoelectronics' Mini BLU conventional chip can be mass-produced and has already cut into the supply chain of several important downstream customers.

Huacan Optoelectronics also discussed the development of several current transfer technologies:

According to the more conventional definitions on the market today, the Mini LED refers to a flip-chip based LED chip with a chip size of 80-300 um for display applications.

Mini LED has two main applications on the display, one is as a self-illuminating LED display (hereinafter referred to as Mini RGB), because the package form does not need to play gold wire, compared to the dressing small pitch LED, even in the same chip size The Mini LED can also be used to make smaller display point spacing. The other is the application on the backlight (hereinafter referred to as Mini BLU). Compared with the traditional backlight LED module, the Mini LED backlight module will adopt a more dense chip arrangement to reduce the light mixing distance and achieve an ultra-thin light source module.

In any application, Mini LED involves the transfer of a large number of LED chips. The huge transfer technology currently developed for Micro LEDs, including the electrostatic force of Luxvue, the electromagnetic force used by ITRI, and the van der Waals force used by X-celeprint, can in principle be used for the transfer of Mini LED chips. However, at present, these transfer technologies need to be specially designed and manufactured for including transfer heads and transfer equipment, and the technology is not fully mature and open, and the production cost is relatively high.

Compared to Micro LEDs, Mini LEDs have a relatively large chip size and a harder substrate. Therefore, the transfer of the Mini LED has a higher degree of precision tolerance, and the chip has more flexibility due to the substrate-to-chip pickup operation. Based on these features of the Mini LED, each company has also developed a transfer technology related to the Mini LED. At present, several technologies that are relatively easy to achieve mass production are shown in the figure.

The first is to make improvements from existing pick and place devices, setting multiple pick up heads to increase the efficiency of picking and placing. The technical difficulty of this kind of scheme is not particularly large, and it is easy to achieve mass production, but the capacity can only achieve multiple growth, and it is impossible to achieve an increase in the order of magnitude.

The second solution is to place the temporary substrate on which the chip is placed and the final back plate, and use the thimble to directly place the chip out of the blue film onto the final substrate. Compared with the first pick and place scheme, this scheme reduces the back and forth movement of the swing arm and improves the transfer efficiency. If the position of the chip on the blue film is the same as the position of the control electrode of the final back plate, the multi-pin transfer method can be realized, and the transfer technology can be realized in an order of magnitude.

The third scheme is similar to the second scheme. The chip is placed on the UV film and the chip position is placed opposite to the control electrode position of the back panel, and then the LED chip is selectively or entirely transferred to the final backplane by UV light. . This kind of scheme can basically realize the real huge amount of transfer technology, but there is a certain demand for the placement accuracy when the chip is sorted onto the UV film.

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