OFweek smart home network intelligence smart home field heavyweight four giant companies are Microsoft, Google, Samsung and Apple, these four giants in the field of smart home leader trend. At present, these foreign smart homes have become a spark, but the domestic smart home industry has never been an outbreak. What are the reasons for this? Xiao Bian combines Chinese and foreign differences. The reasons for the analysis are as follows:
Analyze the causes of differences in domestic and foreign smart homes
1, technology
Smart home is not the same as mobile application control home, CUE is the best solution, but the technology ASR and NLP that match it all need time for better product landing. Especially in the case where one local dialect in China is entirely another set of voices, ASR faces more challenges.
2, units
The overall size of foreign units is relatively large, and the size of China's units is small. The small size of the house means that the home control is more convenient and less painful, and the far light can be turned off in one or two steps. Why do you have to be smart?
3, distrust
Can not be ignored is the electronic product and home improvement in the user's mind has been stereotyped iterative time difference, electronic products give you impression is a few years or even faster, and home is a decade or even slower. This drop will cause users to hesitate, extended out is the quality of "will not be easy to bad"?
4, cost performance
Smart means richer sensors, better chips and more expensive prices. Before the advent of the trend, there are always a few people who are not just spending money.
Thus, for the current domestic smart home, consumers are more concerned about the quality and price of products landing, and as far as technology, domestic and foreign smart homes need to make a breakthrough. Therefore, apart from other issues, as long as domestic smart homes deal with quality and price issues, we believe that domestic smart homes will be more prosperous in the future.
SMA means surface mount assembly. It is a new generation of electronic assembly technology, which compresses traditional electronic components into a device with a volume of only a few tenths.
Surface mounting is not a new concept, it is derived from earlier processes, such as flat mounting and mixed mounting.
For the assembly of electronic circuits, a point-to-point wiring method was initially adopted, and there was no substrate at all. The packaging of the first semiconductor device uses radial pins, which are inserted into the through holes of the monolithic circuit boards that have been used for the packaging of resistors and capacitors. Active components have been widely used in the past ten years.
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