Low-power process design reduces power consumption by 50%

Design complexity, time-to-market, and cost pressures require EDA tools to deliver high-capacity, high-performance digitally integrated design capabilities with a high degree of predictability and reliability verification. On the one hand, it can help customers to achieve more advanced product design, on the other hand, it can avoid the manufacturing risk of product design and shorten the time to market.

Without the help of EDA tools, it is difficult for design companies to make low-power products. Designed with a low-power process, the product can reduce power consumption by at least 50%. Three years ago, we summed up the practice of low-power consumption and formally formed a set of theories. All the links of our own tools were integrated and integrated to form a complete set of low-power technologies. At the same time, we also cooperate with companies in the industry chain and design chain to communicate with the companies with a low-power method, such as IP company ARM and foundry SMIC. We all work closely with them. We bring together industry partners to solve the problem of low power consumption, which is an industrial model.

Low power consumption is a change in the structure of our entire tool, rather than simply adding one. Simply adding one entry may change the timing and affect its function. Therefore, the three aspects of the chip's function, timing, and power consumption should be considered together. Moreover, power consumption is not only considered when the back-end physical implementation, but also when the front-end is to do functional design, structural design and logical design. We started early, and we have a very high share in some of the more advanced low-power chips. Everyone uses Cadence products to make some advanced low-power chips.

The reason why our tools can achieve low power consumption is that when doing logic design and physical design, the functions related to low power are already designed in the tool. The logic integration, data wiring, simulation, etc. all have low power consumption characteristics. Inside, this is a trend. We introduced the earliest version of CPF (Universal Power Format) three years ago. CPF is a method that we apply to tools.

Cadence Encounter's latest digital IC design platform, version 7.1, adds many industry-leading features to Encounter 6.2, freeing customers from complex design challenges and focusing on their core competencies - design innovation in.

In addition, Cadence Design Systems recently announced the C-to-SiliconCompiler (Compiler), a high-end, comprehensive product that enables designers to increase productivity by up to 10x while creating and multiplexing system-on-chip IP. This important new feature is especially valuable for companies developing new SoCs (system-on-a-chip) and system-level IP for the consumer electronics, wireless and wireline networking markets. C-to-SiliconCompiler improves design quality and reduces design time by developing products with partners.

In response to the continuous improvement of semiconductor process technology, Cadence's new tools can also adapt to 32-nanometer design, but subsequent projects such as wiring and other requirements are different, and need to be combined with Cadence follow-up tools. At the same time, to ensure the best performance, this new tool is best combined with other Cadence tools, because Cadence is fully optimized, and if combined with other company tools, it may take some time to optimize.

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