Study on the microstructure of silicon-based nano-films prepared by vacuum low-energy electron beam Chen Jiongshu In the process, the substrate surface was first hydroxylated by Piranha solution, and secondly, the substrate modified with -OH was immersed in the APTMS solution for self-assembly, so that the terminal group was obtained as a functional group (-NH2) on the surface of the substrate ) Regular distribution. Secondly, the substrate is scanned and exposed by electron beam to form a pattern. Then the substrate is placed in colloidal gold. Due to the chemical nature of the surface functional groups, the gold nanoparticles will be selectively adsorbed on -NH2 Finally, put the substrate into HAuCVNH2OH solution, the gold nanoparticles adsorbed on the surface of the substrate will continue to grow under the action of HAuCVNH2OH, and form a thin film. Through such a process, we can base on the colloidal liquid A micro-patterned gold film was obtained on the surface of the wafer. It is an optical microscope photograph of the micro-patterned gold film on the silicon wafer substrate. The dark areas are The beamlet irradiation area is not covered by the gold film; the bright area is the APTMS modified area, which is covered by the gold film. It shows that the obtained micro-patterned gold film has a large-area regular pattern and has clear boundaries. The minimum resolution of this method depends on Due to the size of the beam spot diameter, currently, the most advanced electron beam direct writing exposure system can focus the electron beam spot to 2nm, and the finest pattern exposed is 8nm. However, under our experimental conditions, the micro-patterning The resolution of the gold film is about 30Mm (see).
In order to prove whether the growth of the gold film is only in the APTMS modified area, we conducted an experiment with AES line scan Au. (A) SEM image of silicon-based patterned gold thin film. The results show that there is a gold film on the surface of the APTMS modified substrate that is not irradiated by electron beam, and the gold content in the area irradiated by electron beam is greatly reduced. This may be due to the easy formation of chemical bonds between -NH2 and gold nanoparticles, so that gold nanoparticles can generate chemical adsorption on the -NH2 (APTMS) base, and the adsorption on the surface of the silicon wafer is simply physical adsorption. After assembling the gold nanoparticles, the substrate is cleaned in an ultrasonic cleaner, and the gold particles physically adsorbed on the surface are easily removed. In this way, when gold is chemically deposited in the HAuCVNH2OH solution, only -NH2 (APTMS) has gold particles adsorbed on its surface. Naturally, as the gold particles grow and bind, a gold thin film is formed on the APTMS-modified surface and no gold film is formed on the APTMS-free surface. Thereby, a gold film with selective chemical deposition in the positioning area is realized. (B) Au content curve of AES line scan. The experimental results confirmed that a regular and selective gold thin film pattern was formed on the surface modified by electron beam. The gold content of the electron beam irradiated area decreased by several times compared with the non-irradiated area.
The SKM image axis of the silicon pile is a gold film. 2.2 The choice of colloidal gold nanoparticle size The synthesis method of colloidal gold nanoparticles is relatively mature, and it can obtain particles of 25120nm with good dispersion. 16. Using nanoparticles of different sizes The films are also different. For example, under the above experimental conditions, when larger gold particles are used to prepare a gold thin film, it is difficult to obtain a smooth, smooth surface film. This may be due to the larger repulsion between the particles when the particles are larger. The particles are far away from each other after they are adsorbed on the APTMS surface. Although the particles continue to grow in the next electroless plating process (HAuCVNH2OH solution), they are due to the distance between them. It is difficult to bond to each other because it is far away, so it is difficult to form a uniform film. The resulting film has more pores and a larger surface roughness.
In order to obtain a gold film with a uniform and smooth surface, we selected nanoparticles with small particles and good dispersibility as the seeds before electroless plating. "It is a transmission electron microscope photograph of the colloidal gold nanoparticles we use. The size is about 3nm, and there is no obvious agglomeration. In addition, its ultraviolet absorption peak at 520nm (see) also shows that the gold colloid has a monodisperse 18. m5 colloidal gold nano-duck particles UV spectrum 2.3 Ai ions during the growth of the film It is reduced to Au element, but why the reaction only occurs on the surface of the substrate. This is because the reaction is a surface catalytic reaction. The colloidal gold adsorbed on the surface catalyzes the process of NH2H reducing Ai ions. In terms of thermodynamics, NH2H has a reduction of Ai The ability of ions to be a single element of gold, this reduction process is strongly accelerated by the colloidal gold adsorbed on the surface. Vacuum Science and Technology, 1998, edited by Zhang Yichen, Northeastern University: The book Vacuum Materials was published by the Metallurgical Industry in December 2005 Published and published by the company. The book has 14 chapters and discusses the basic theory, mechanical, physical and chemical, electromagnetic and vacuum performance and vacuum performance of vacuum materials in more detail. Metals, non-metals and magnetic materials used by Cheng Technology; target materials for sputter coating; vacuum auxiliary materials; getter and adsorbent; vacuum engineering oil; properties of materials commonly used in vacuum technology, working medium of cryogenic refrigeration system, etc. Technical characteristic parameters, process characteristics, selection and application, etc. The book contains not only basic theory but also practical application, and provides a large number of related chart data. It is a comprehensive book on the application materials of vacuum engineering. Vacuum technology research, design, and application fields require highly practical books and textbooks that can be used as related majors in colleges and universities.
How to buy books â‘ The major Xinhua bookstores in the country; â‘¡ Mail order of the publishing department of Metallurgical Industry Press) Tel: (010) Fax: (010) 64027893; â‘¢ Mail order of Beijing Metallurgical Bookstore) Tel: (010) (Vacuum Magazine) by Xu Chenghai, Northeastern University Professor as editor-in-chief, Professor Ba Dechun, Northeastern University), Professor Yu Pu-level senior engineer: Shenyang Vacuum Technology Institute), Dadaoan Researcher, 510 Institute of Space Department, Associate Professor Zhang Shiwei, Northeastern University) Associate Editor-in-Chief of Vacuum Engineering Technology Published by the Chemical Industry Press in September 2006. The book is about 2 million words, a total of 32 chapters, covering the basics of vacuum technology, vacuum pumps, vacuum measuring instruments, vacuum valves, seals and other parts, as well as the design and calculation of vacuum containers and vacuum systems and the application of vacuum technology in various industrial fields. , Including metallurgy, heat treatment, coating, drying, dipping, packaging, distillation, filtration, transportation, thermal insulation, aerospace, children's industrial fields, as well as vacuum engineering materials and processes. This book is one of the more comprehensive engineering technology books in the vacuum engineering technology community. This book invites Academician Wen Lishi, academician of the Chinese Academy of Engineering, to write a preface, and hires Professor Yang Naiheng, a well-known person in the vacuum, as the chairman of the advisory committee, Professor Li Yunqi, Professor Jiang Xiechang, senior engineer, Researcher Fan Chuzhen, and Professor Zhang Shulin as the deputy directors of the advisory committee, Hefei Industry Professor Hu Huanlin and other dozens of vacuum science and technology workers participated in the compilation work. Available at Xinhua Bookstore and Reader Service Department of Chemical Publishing House (100029 Building 3, Huixinli, Chaoyang District, Beijing), priced at 180 yuan.
(Contributed by Zhang Zhijun, Northeastern University)
Automatic Traffic Door Wiring Harness
Automatic traffic doors are an important part of urban rail transit vehicles and are closely related to operational safety. The door system consists of a door, a mechanism lock, an emergency unlocking device, a transmission device, and an isolation locking device.
There are four types of doors: passenger compartment door, cab door, partition door between cab and passenger compartment, emergency evacuation door. It needs to be used; the compartment door is only used when the train driver changes ends; the emergency evacuation door is only used when the passenger compartment door cannot be opened in an emergency or when the train is evacuating and evacuating in the section, and its use frequency is low.
With the increasing convenience of transportation and the popularization of rail transit, the demand for automatic traffic door wiring harness will also increase.
Suzhou Kable-X promises to customers that every Wire Harness product that goes out of the Kable-X factory meets the EU ROHS certification standards. Suzhou Kable-X wire harness processing factory upholds the "integrity, responsibility, and innovation" business philosophy, and perfect after-sales service and customers "Join hands to create a better tomorrow".
We can not only provide you with Automatic Traffic Door Wiring Harness, but also other Industrial Cable Assembly, including Power Equipment Wire Harness and Automatic Traffic Door Wiring Harness.
Automatic Traffic Door Wiring Harness,Wire Harness Pcb,Universal Wiring Harness,Engine Wiring
Kable-X Technology (Suzhou) Co., Ltd , https://www.kable-x-tech.com