Heat dissipation is a major factor affecting the illumination intensity of LED lamps. LED luminaires are 80% more energy efficient than conventional incandescent lamps, but their LED components and driver circuits dissipate a lot. If these heats are not properly discharged, the luminosity and lifetime of the LED luminaire will drop dramatically.
The heat sink can solve the heat dissipation problem of low illumination LED lamps. Lamp manufacturers can produce 40W LED replacement lamps and 60W LED replacement lamps. High-illumination LED luminaires experience heat dissipation problems. A heat sink can't solve the heat dissipation problem of 75W or 100W LED lamps.
The demand for high-brightness bulbs is clear, with 75W and 100W bulbs occupying a large share of the lighting market. The market is eager to take advantage of the inherent energy savings and maintenance of LED luminaires. The 2007 US Energy Independence and Security Act requires the use of more efficient lighting fixtures starting in 2012. These new requirements are driving consumers to look for existing incandescent lamps with good lighting quality, long life and high illumination.
In order to achieve the desired illumination intensity, active cooling technology must be used to address the heat released by the LED luminaire assembly. Some active cooling solutions such as fans have a high life without LED luminaires. In order to provide a practical active cooling solution for high-brightness LED luminaires, the cooling technology must be low-energy; and can be applied to small luminaires; its lifetime should be similar to or higher than the source.
Heat dissipation method
In general, the heat sink can be divided into active heat sink and passive heat sink according to the way heat is removed from the heat sink. The so-called passive heat dissipation means that the heat of the heat source LED light source is naturally radiated into the air through the heat sink, and the heat dissipation effect is proportional to the size of the heat sink, but because of the natural heat dissipation, the effect is of course greatly reduced, and is often used in those space spaces. In equipment that is not required, or used to dissipate heat for components that generate less heat. For example, some popular motherboards also adopt passive heat dissipation on the North Bridge. Most of them adopt active heat dissipation. Active heat dissipation is forced by heat sinks such as fans. The heat emitted by the heat sink is taken away, which is characterized by high heat dissipation efficiency and small size of the device.
Active heat dissipation, subdivided from the heat dissipation method, can be divided into air cooling, liquid cooling, heat pipe cooling, semiconductor refrigeration, chemical refrigeration and so on.
Basic Features
1. The terminal has universal mounting feet so that it can be installed on U-rail NC 35 and G-rail NC32.
2. The closed screw guide hole ensures ideal screwdriver operation.
3. Equipped with uniform accessories for terminals of multiple cross-section grades, such as end plates, grouping partitions, etc.
4. Potential distribution can be achieved by inserting a fixed bridge in the center of the terminal or an edge-plug bridge inserted into the wire cavity.
5. The grounding terminal and the N-line slider breaking terminal with the same shape as the common terminal.
6. Using the identification system ZT, unified terminal identification can be realized.
7. The rich graphics enhance the three-dimensional sense of the wiring system.
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Sichuan Xinlian electronic science and technology Company , https://www.sztmlchs.com