Recently, the market has reported that TSMC will not sign contracts with Apple in 2011, and even the price of incoming orders may be very poor. However, according to semiconductor related companies, Apple and TSMC have recently signed an agreement, in the next few years will be for A6, A7, etc. The new generation of processors, one after another using 28, 20 nanometer and other new generation processes for OEM cooperation, and in the 28 and 20 nanometer process has been finalized part of the offer price range, Apple released goodwill, the original two parties deadlocked for a long time foundry The price rises upward, which is close to the average gross margin level of TSMC, rather than the industry's perceived low gross margin.
Semiconductor makers pointed out that if TSMC takes 28 nanometers to win at least 30% of A6 processor OEM orders, it is estimated that this order will account for about 6% of TSMC’s revenue in 2011, accounting for 40% of creative revenue. The contribution is relatively obvious. In addition, after entering the 20-nanometer process, because Apple did not! Samsung has signed a contract for subcontracting processes below 20nm. Therefore, TSMC will have the opportunity to obtain all OEM orders, and the idea is expected to be accompanied by rain.
In fact, Apple used the A4 and A5 processor generations and today's A6 processors, including crystals, foundry circuits, circuit board design, and packaging and testing, all of which were eaten by Samsung. The TSMC and Apple's cooperation will be a big deal. Reverse the past. As for the industry’s concerns about infringement, there is no doubt of infringement due to the redesign of the circuit board circuit that was submitted to the idea.
It is noteworthy that this time, TSMC and Apple signed an agreement except for OEM and circuit design. The two sides did not talk about the latter part of the closure test. The industry may adopt a similar Samsung model in the early stages of the trial, and TSMC will test the package. It is impossible for TSMC to completely take orders for the Apple processor's packaging and testing. Apple may evaluate the packaging and testing committees in the next three months and determine the capabilities of the company before deciding.
For the packaging and testing plant, because the future will be sealed and IC carrier board will be determined by the Apple Turnkey, rather than determined by the foundry, all companies have the opportunity to obtain orders, but it is difficult to fully grasp. Among them, Riyueguang owns the advantage of sealing and measuring orders for Qualcomm's communication chips. It was originally listed as the apple's supply chain, and the chance of obtaining orders is not small.
On the counterfeit goods side, in the recent active contact with Apple, Apple sent a low-key staff to visit the counterfeit plant in July to discuss possible future cooperation opportunities. The opportunity for counterfeit products to enter the Apple supply chain was greatly increased. As for Amkor, which used to operate major international integrated component (IDM) plants in the past, it also has considerable strength to obtain orders.
1.0mm (.039″) Pitch Pin Headers
Overview
Antenk offers a variety of high quality and competitively priced 1.0mm pitch single, dual, three, quad row pin (male) headers used in many board-to-board PCB connections, fitting small-sized, densely-packed devices.
This low-profile component is made from high-temperature thermoplastic and is offered with several means of connections and mounting styles such as through-hole (THM) or surface mount (SMT) and can be in vertical (straight), elevated or at a right angle configuration/orientation dissipating current of about 1.0 A or less.
The pin (male) header is generally mated with receptacle or stackable header connectors (female sockets). This types of pin headers are suitable for PCB board to board connection or for signal transmission application.
Applications of 1.0mm Pitch Pin Headers
Its small size is most suitable for PCB connections of small equipment and devices such as WiFi equipment, gaming consoles, measurement instruments, and other equipment in need of a special interface to become interconnected
Mount Type: Through-hole vs Surface Mount
At one side of this pin header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
1.0mm vertical single row header, 1.0mm vertical dual row header, 1.0mm Elevated single row pin header, 1.0mm Elevated dual row pin Header, 1.0mm Right-angle single row header and 1.0mm Right-angle dual row header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
1.0mm Right-angle Dual Row pin header, 1.0mm SMT Single row pin header, 1.0mm SMT Dual row pin header and 1.0mm Elevated Dual Row Pin Header are Antenk`s SMT pin headers.
Soldering Temperature for 1.0mm Pitch Pin Headers
Soldering SMT pin header can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Pin-Type: Vertical (Straight) and Right-Angle
1.0mm pitch headers may be further classified into pin orientation as well, such as vertical or straight male header or right-angle male header.
Vertical or Straight Pin (Male) Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Right-Angle Pin (Male) Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
PCB Connector Stacking
Elevated Pin Header Orientation
Elevated pins aka Stacked Pins or Mezzanine are simply stacked pin headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
Profile Above PCB
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Single, Dual or Multiple Number of Rows
For a 1.0mm straight or vertical male pin header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3 ,4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-50 pins while for dual row, the number contacts may vary from 4-100 pins.
Pin Material
The pins of the connector have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Breakaway design
The pin headers are also equipped with a breakaway design making them fully compatible with their female receptacles.
Custom 1.0mm Pitch Pin Headers
Customizable 1.0 mm pitch pin headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
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ShenZhen Antenk Electronics Co,Ltd , https://www.antenkconn.com